Описание
Характеристики
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Описание
SOT23 Surface-Mounted Package Products
Nexperia SOT23 Surface-Mounted Package Products are contained in a plastic, surface-mounted, three terminals, 1.9mm pitch, 2.9mm x 1.3mm x 1mm package. This mainstay package in semiconductors was introduced in 1969 and quickly became an industry standard. The SOT23 encapsulates an extensive range of diodes, bipolar transistors, MOSFETs, and ESD protection devices within Nexperia's portfolio. The SOT23 package has been a constant for the last 50 years, leading to several offspring, such as the SOT223 and SOT323.
Характеристики
Статус наличия (общий)
Под заказ
Детали наличия
,срок 7-8 недель
Тех. документация (ссылки)
https://static.chipdip.ru/lib/195/DOC011195252.pdf
https://static.chipdip.ru/lib/549/DOC030549785.pdf
Ссылка на товар
https://www.chipdip.ru/product/pesd3v3f2utr-clamp-ipp-tvs-diode-surface-mount-nexperia-8008621357
Производитель
Nexperia B.V.
Contact Plating
Gold
Housing Material
Polyester
Manufacturer
Samtec
Maximum Operating Temperature
+125 C
Minimum Operating Temperature
-55 C
Mounting Angle
Vertical
Number of Positions
20 Position
Number of Rows
1 Row
Packaging
Bulk
Pitch
2.54 mm(0.1 in)
Product
Headers
Product Category
Board to Board & Mezzanine Connectors
Stack Height
0.7 in
Termination Style
Solder
Brand
Samtec
Contact Material
Phosphor Bronze
Mounting Style
Throuh Hole
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